Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10262943 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Kaihan Ashtiani +2 more | 2019-04-16 |
| 10103056 | Methods for wet metal seed deposition for bottom up gapfill of features | Samantha Tan, Boris Volosskiy, Taeseung Kim, Novy Tjokro, Artur Kolics | 2018-10-16 |
| 9875968 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Kaihan Ashtiani +2 more | 2018-01-23 |
| 9837312 | Atomic layer etching for enhanced bottom-up feature fill | Samantha Tan, Taeseung Kim, Jengyi Yu, Novy Tjokro, Artur Kolics +1 more | 2017-12-05 |
| 9818617 | Method of electroless plating using a solution with at least two borane containing reducing agents | Artur Kolics, Xiaomin Bin, Nanhai Li, Yaxin Wang, Patrick William Little +1 more | 2017-11-14 |
| 9768063 | Dual damascene fill | Artur Kolics, Lie Zhao | 2017-09-19 |
| 9583386 | Interlevel conductor pre-fill utilizing selective barrier deposition | Artur Kolics, William T. Lee, Larry Zhao, Derek Wong, Kaihan Ashtiani +2 more | 2017-02-28 |
| 9551074 | Electroless plating solution with at least two borane containing reducing agents | Artur Kolics, Xiaomin Bin, Nanhai Li, Yaxin Wang, Patrick William Little +1 more | 2017-01-24 |
| 9353444 | Two-step deposition with improved selectivity | Artur Kolics, Seshasayee Varadarajan | 2016-05-31 |
| 9287183 | Using electroless deposition as a metrology tool to highlight contamination, residue, and incomplete via etch | Larry Zhao, Artur Kolics | 2016-03-15 |
| 9029258 | Through silicon via metallization | Novy Tjokro, Artur Kolics, Seshasayee Varadarajan | 2015-05-12 |
| 8946087 | Electroless copper deposition | — | 2015-02-03 |
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, John M. Boyd +3 more | 2011-02-08 |
| 7709400 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, John M. Boyd +3 more | 2010-05-04 |