Issued Patents All Time
Showing 25 most recent of 73 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9359673 | Apparatus and method for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, John M. Boyd, Yezdi Dordi | 2016-06-07 |
| 9287110 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2016-03-15 |
| 9117860 | Controlled ambient system for interface engineering | John M. Boyd, Yezdi Dordi, Tiruchirapalli Arunagiri, Benjamin W. Mooring, John Parks +7 more | 2015-08-25 |
| 9076844 | Process integration scheme to lower overall dielectric constant in BEoL interconnect structures | Nicolas Bright, David Hemker, Yezdi Dordi | 2015-07-07 |
| 9058975 | Cleaning solution formulations for substrates | Artur Kolics | 2015-06-16 |
| 9006893 | Devices for metallization | Artur Kolics, William T. Lee | 2015-04-14 |
| 8970027 | Metallization mixtures and electronic devices | Artur Kolics | 2015-03-03 |
| 8916232 | Method for barrier interface preparation of copper interconnect | Hyungsuk Alexander Yoon, John M. Boyd, Yezdi Dordi | 2014-12-23 |
| 8844461 | Fluid handling system for wafer electroless plating and associated methods | William Thie, John M. Boyd, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2014-09-30 |
| 8771804 | Processes and systems for engineering a copper surface for selective metal deposition | Yezdi Dordi, John M. Boyd, Tiruchirapalli Arunagiri, William Thie, Arthur M. Howald | 2014-07-08 |
| 8747960 | Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide | Yezdi Dordi, John M. Boyd, Tiruchirapalli Arunagiri, Johan VERTOMMEN, William Thie +1 more | 2014-06-10 |
| 8691027 | Method for removing material from semiconductor wafer and apparatus for performing the same | Mikhail Korolik, Michael Ravkin, John M. de Larios, John M. Boyd | 2014-04-08 |
| 8673769 | Methods and apparatuses for three dimensional integrated circuits | John M. Boyd, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2014-03-18 |
| 8622020 | Simultaneous electroless plating of two substrates | William Thie, John M. Boyd, Yezdi Dordi | 2014-01-07 |
| 8623456 | Methods for atomic layer deposition | Hyungsuk Alexander Yoon, Mikhail Korolik, John M. Boyd, Yezdi Dordi | 2014-01-07 |
| 8590550 | Apparatus for cleaning contaminants from substrate | Mikhail Korolik, Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Mike Ravkin | 2013-11-26 |
| 8535451 | Method and apparatus for cleaning semiconductor wafers using compressed and/or pressurized foams, bubbles, and/or liquids | John M. de Larios, Mike Ravkin, Jeffrey Farber, Mikhail Korolik, Aleksander Owczarz | 2013-09-17 |
| 8519461 | Device with post-contact back end of line through-hole via integration | John M. Boyd, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2013-08-27 |
| 8518826 | Metallization processes, mixtures, and electronic devices | Artur Kolics | 2013-08-27 |
| 8518815 | Methods, devices, and materials for metallization | Artur Kolics, William T. Lee | 2013-08-27 |
| 8485120 | Method and apparatus for wafer electroless plating | William Thie, John M. Boyd, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2013-07-16 |
| 8480810 | Method and apparatus for particle removal | Erik M. Freer, John M. de Larios, Katrina Mikhaylichenko, Michael Ravkin, Mikhail Korolik | 2013-07-09 |
| 8475599 | Substrate preparation using stabilized fluid solutions and methods for making stable fluid solutions | Erik M. Freer, John M. de Larios, Michael Ravkin, Mikhail Korolik, Katrina Mikhaylichenko | 2013-07-02 |
| 8388762 | Substrate cleaning technique employing multi-phase solution | Erik M. Freer, John deLarios, Michael Ravkin, Mikhail Korolik | 2013-03-05 |
| 8323420 | Method for removing material from semiconductor wafer and apparatus for performing the same | Mikhail Korolik, Michael Ravkin, John deLarios, John M. Boyd | 2012-12-04 |