| 9359673 |
Apparatus and method for atomic layer deposition |
Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, Yezdi Dordi |
2016-06-07 |
$22,992,000 |
| 9287110 |
Method and apparatus for wafer electroless plating |
William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more |
2016-03-15 |
$14,451,000 |
| 9117860 |
Controlled ambient system for interface engineering |
Yezdi Dordi, Tiruchirapalli Arunagiri, Benjamin W. Mooring, John Parks, William Thie +7 more |
2015-08-25 |
$12,392,000 |
| 8926789 |
Apparatus for the removal of a fluorinated polymer from a substrate |
Hyungsuk Alexander Yoon, Andras Kuthi, Andrew D. Bailey, III |
2015-01-06 |
$34,643,000 |
| 8916232 |
Method for barrier interface preparation of copper interconnect |
Hyungsuk Alexander Yoon, Yezdi Dordi, Fritz Redeker |
2014-12-23 |
$71,205,000 |
| 8844461 |
Fluid handling system for wafer electroless plating and associated methods |
William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more |
2014-09-30 |
$8,350,000 |
| 8771804 |
Processes and systems for engineering a copper surface for selective metal deposition |
Yezdi Dordi, Tiruchirapalli Arunagiri, Fritz Redeker, William Thie, Arthur M. Howald |
2014-07-08 |
$33,331,000 |
| 8747960 |
Processes and systems for engineering a silicon-type surface for selective metal deposition to form a metal silicide |
Yezdi Dordi, Tiruchirapalli Arunagiri, Johan VERTOMMEN, Fritz Redeker, William Thie +1 more |
2014-06-10 |
$20,157,000 |
| 8691027 |
Method for removing material from semiconductor wafer and apparatus for performing the same |
Mikhail Korolik, Michael Ravkin, John M. de Larios, Fritz Redeker |
2014-04-08 |
$6,512,000 |
| 8673769 |
Methods and apparatuses for three dimensional integrated circuits |
Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li |
2014-03-18 |
$5,780,000 |
| 8622020 |
Simultaneous electroless plating of two substrates |
William Thie, Yezdi Dordi, Fritz Redeker |
2014-01-07 |
$5,237,000 |
| 8623456 |
Methods for atomic layer deposition |
Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, Yezdi Dordi |
2014-01-07 |
$5,237,000 |
| 8519461 |
Device with post-contact back end of line through-hole via integration |
Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li |
2013-08-27 |
$4,348,000 |
| 8490573 |
Method and apparatus for material deposition |
Yezdi Dordi, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook |
2013-07-23 |
$7,904,000 |
| 8485120 |
Method and apparatus for wafer electroless plating |
William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more |
2013-07-16 |
$5,810,000 |
| 8419917 |
Electroplating head and method for operating the same |
Yezdi Dordi, Bob Maraschin, Fred C. Redeker |
2013-04-16 |
$11,521,000 |
| 8403727 |
Pre-planarization system and method |
Fred C. Redeker, Yezdi Dordi, Sabir A. Majumder, Simon McClatchie |
2013-03-26 |
$11,016,000 |
| 8330072 |
System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology |
Fred C. Redeker |
2012-12-11 |
$5,034,000 |
| 8323460 |
Methods and systems for three-dimensional integrated circuit through hole via gapfill and overburden removal |
Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li |
2012-12-04 |
$6,751,000 |
| 8323420 |
Method for removing material from semiconductor wafer and apparatus for performing the same |
Mikhail Korolik, Michael Ravkin, John deLarios, Fritz Redeker |
2012-12-04 |
$6,751,000 |
| 8314027 |
Wafer electroless plating system and associated methods |
William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more |
2012-11-20 |
$3,027,000 |
| 8287647 |
Apparatus and method for atomic layer deposition |
Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, Yezdi Dordi |
2012-10-16 |
$13,488,000 |
| 8241701 |
Processes and systems for engineering a barrier surface for copper deposition |
Yezdi Dordi, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon, Fritz Redeker, William Thie +1 more |
2012-08-14 |
$19,293,000 |
| 8187968 |
Methods of post-contact back end of line through-hole via integration |
Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li |
2012-05-29 |
$6,894,000 |
| 8133812 |
Methods and systems for barrier layer surface passivation |
Yezdi Dordi, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Alex Yoon |
2012-03-13 |
$11,349,000 |
