Issued Patents All Time
Showing 26–50 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8069813 | Wafer electroless plating system and associated methods | William Thie, Fritz Redeker, Yezdi Dordi, John Parks, Tiruchirapalli Arunagiri +5 more | 2011-12-06 |
| 8053355 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2011-11-08 |
| 8048283 | Method and apparatus for plating semiconductor wafers | Yezdi Dordi, Bob Maraschin, Fred C. Redeker, Carl Woods | 2011-11-01 |
| 8026605 | Interconnect structure and method of manufacturing a damascene structure | Yezdi Dordi, Fritz Redeker, William Thie, Tiruchirapalli Arunagiri, Hyungsuk Alexander Yoon | 2011-09-27 |
| 7947157 | Apparatus and method for depositing and planarizing thin films of semiconductor wafers | Mike Ravkin, Yezdi Dordi, Fred C. Redeker, John M. de Larios | 2011-05-24 |
| 7909934 | Megasonic cleaning efficiency using auto-tuning of a RF generator at constant maximum efficiency | Andras Kuthi, Michael G. R. Smith, Thomas W. Anderson, William Thie | 2011-03-22 |
| 7884017 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, Mikhail Korolik +3 more | 2011-02-08 |
| 7875554 | Method for electroless depositing a material on a surface of a wafer | Yezdi Dordi, William Thie, Bob Maraschin, Fred C. Redeker, Joel M. Cook | 2011-01-25 |
| 7862693 | Apparatus for plating semiconductor wafers | Yezdi Dordi, Fred C. Redeker, Robert A. Maraschin, Carl Woods | 2011-01-04 |
| 7829152 | Electroless plating method and apparatus | William Thie, Yezdi Dordi, Fritz Redeker | 2010-11-09 |
| 7810513 | Substrate preparation using megasonic coupling fluid meniscus and methods, apparatus, and systems for implementing the same | Fritz Redeker, Seokmin Yun | 2010-10-12 |
| 7752996 | Apparatus for applying a plating solution for electroless deposition | Yezdi Dordi, William Thie, Fritz Redeker, Aleksander Owczarz | 2010-07-13 |
| 7749893 | Methods and systems for low interfacial oxide contact between barrier and copper metallization | Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2010-07-06 |
| 7749689 | Methods for providing a confined liquid for immersion lithography | David Hemker, Fred C. Redeker, John M. de Larios, Michael Ravkin, Mikhail Korolik | 2010-07-06 |
| 7709400 | Thermal methods for cleaning post-CMP wafers | Zhonghui Wang, Tiruchirapalli Arunagiri, Fritz Redeker, Yezdi Dordi, Mikhail Korolik +3 more | 2010-05-04 |
| 7704367 | Method and apparatus for plating semiconductor wafers | Yezdi Dordi, Bob Maraschin, Fred C. Redeker, Carl Woods | 2010-04-27 |
| 7691278 | Apparatus for the removal of a fluorinated polymer from a substrate and methods therefor | Hyungsuk Alexander Yoon, Andras Kuthi, Andrew D. Bailey, III | 2010-04-06 |
| 7675000 | System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology | Fred C. Redeker | 2010-03-09 |
| 7648616 | Apparatus and method for semiconductor wafer electroplanarization | Fritz Redeker, Yezdi Dordi, Michael Ravkin, Robert A. Maraschin | 2010-01-19 |
| 7645364 | Apparatus and method for plating semiconductor wafers | Yezdi Dordi, Fred C. Redeker, Robert A. Maraschin, Carl Woods | 2010-01-12 |
| 7615480 | Methods of post-contact back end of the line through-hole via integration | Fritz Redeker, Yezdi Dordi, Hyungsuk Alexander Yoon, Shijian Li | 2009-11-10 |
| 7615486 | Apparatus and method for integrated surface treatment and deposition for copper interconnect | Hyungsuk Alexander Yoon, Mikhail Korolik, Fritz Redeker, Yezdi Dordi | 2009-11-10 |
| 7604011 | Method and apparatus for semiconductor wafer cleaning using high-frequency acoustic energy with supercritical fluid | Fred C. Redeker, John Parks | 2009-10-20 |
| 7596886 | Method and system to separate and recycle divergent chemistries | Fred C. Redeker | 2009-10-06 |
| 7598175 | Apparatus and method for confined area planarization | Fritz Redeker, Yezdi Dordi, Michael Ravkin, John M. de Larios | 2009-10-06 |