Issued Patents All Time
Showing 76–100 of 135 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7090562 | Methods of and apparatus for pre-planarizing a substrate | Fred C. Redeker, Yezdi Dordi | 2006-08-15 |
| 7048608 | Semiconductor wafer material removal apparatus and method for operating the same | Fred C. Redeker, Yezdi Dordi | 2006-05-23 |
| 7045019 | Method for performing site-specific backside particle and contamination removal | David Hemker | 2006-05-16 |
| 7040332 | Method and apparatus for megasonic cleaning with reflected acoustic waves | Fred C. Redeker, Randolph Treur, William Thie | 2006-05-09 |
| 7040330 | Method and apparatus for megasonic cleaning of patterned substrates | Michael Ravkin, Fred C. Redeker | 2006-05-09 |
| 7025854 | Method and apparatus for aligning and setting the axis of rotation of spindles of a multi-body system | Aleksander Owczarz, Miguel Saldana | 2006-04-11 |
| 6995067 | Megasonic cleaning efficiency using auto-tuning of an RF generator at constant maximum efficiency | Andras Kuthi, Michael G. R. Smith, Thomas W. Anderson, William Thie | 2006-02-07 |
| 6988934 | Method and apparatus of a variable height and controlled fluid flow platen in a chemical mechanical polishing system | Gregory C. Lee, Simon McClatchie | 2006-01-24 |
| 6976906 | Apparatus for reducing compressed dry air usage during chemical mechanical planarization | David Wei, Yehiel Gotkis | 2005-12-20 |
| 6953515 | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection | Michael S. Lacy | 2005-10-11 |
| 6945856 | Subaperture chemical mechanical planarization with polishing pad conditioning | Michael S. Lacy, David G. Halley | 2005-09-20 |
| 6936133 | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool | Michael S. Lacy | 2005-08-30 |
| 6913521 | Methods using active retainer rings for improving edge performance in CMP applications | Alek Owczarz, Rod Kistler | 2005-07-05 |
| 6910240 | Wafer bevel edge cleaning system and apparatus | Fred C. Redecker, James P. Garcia | 2005-06-28 |
| 6899601 | Method and apparatus for conditioning a polishing pad | — | 2005-05-31 |
| 6869337 | System and method for polishing and planarizing semiconductor wafers using reduced surface area polishing pads and variable partial pad-wafer overlapping techniques | Yehiel Gotkis, Rod Kistler | 2005-03-22 |
| 6864181 | Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition | Fred C. Redeker | 2005-03-08 |
| 6858091 | Method for controlling galvanic corrosion effects on a single-wafer cleaning system | Mike Ravkin, Katrina Mikhaylich | 2005-02-22 |
| 6857435 | Method and apparatus for cooling a resonator of a megasonic transducer | John deLarios, Carl Woods | 2005-02-22 |
| 6845778 | In-situ local heating using megasonic transducer resonator | Katrina Mikhaylich | 2005-01-25 |
| 6808442 | Apparatus for removal/remaining thickness profile manipulation | David Wei, Yehiel Gotkis, Aleksander Owczarz, Rod Kistler | 2004-10-26 |
| 6800020 | Web-style pad conditioning system and methods for implementing the same | Katrina Mikhaylich | 2004-10-05 |
| 6776695 | Platen design for improving edge performance in CMP applications | Alek Owczarz, Rod Kistler | 2004-08-17 |
| 6752703 | Chemical mechanical polishing apparatus and methods with porous vacuum chuck and perforated carrier film | Miguel Saldana, Damon Vincent Williams | 2004-06-22 |
| 6733615 | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool | Michael S. Lacy | 2004-05-11 |