| 7435161 |
Multi-layer polishing pad material for CMP |
Abaneshwar Prasad |
2008-10-14 |
| 6953515 |
Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
John M. Boyd |
2005-10-11 |
| 6945856 |
Subaperture chemical mechanical planarization with polishing pad conditioning |
John M. Boyd, David G. Halley |
2005-09-20 |
| 6936133 |
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
John M. Boyd |
2005-08-30 |
| 6884156 |
Multi-layer polishing pad material for CMP |
Abaneshwar Prasad, Roland Sevilla |
2005-04-26 |
| 6875091 |
Method and apparatus for conditioning a polishing pad with sonic energy |
Allan M. Radman, Alan J. Jensen, Helmuth Treichel, Robert G. Boehm, Jr., Eric A. Dunton |
2005-04-05 |
| 6809031 |
Method for manufacturing a reclaimable test pattern wafer for CMP applications |
— |
2004-10-26 |
| 6733615 |
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
John M. Boyd |
2004-05-11 |
| 6609961 |
Chemical mechanical planarization belt assembly and method of assembly |
John M. Boyd |
2003-08-26 |
| 6599765 |
Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection |
John M. Boyd |
2003-07-29 |
| 6554688 |
Method and apparatus for conditioning a polishing pad with sonic energy |
— |
2003-04-29 |
| 6547651 |
Subaperture chemical mechanical planarization with polishing pad conditioning |
John M. Boyd, David G. Halley |
2003-04-15 |
| 6495464 |
Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool |
John M. Boyd |
2002-12-17 |
