Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7435161 | Multi-layer polishing pad material for CMP | Abaneshwar Prasad | 2008-10-14 |
| 6953515 | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection | John M. Boyd | 2005-10-11 |
| 6945856 | Subaperture chemical mechanical planarization with polishing pad conditioning | John M. Boyd, David G. Halley | 2005-09-20 |
| 6936133 | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool | John M. Boyd | 2005-08-30 |
| 6884156 | Multi-layer polishing pad material for CMP | Abaneshwar Prasad, Roland Sevilla | 2005-04-26 |
| 6875091 | Method and apparatus for conditioning a polishing pad with sonic energy | Allan M. Radman, Alan J. Jensen, Helmuth Treichel, Robert G. Boehm, Jr., Eric A. Dunton | 2005-04-05 |
| 6809031 | Method for manufacturing a reclaimable test pattern wafer for CMP applications | — | 2004-10-26 |
| 6733615 | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool | John M. Boyd | 2004-05-11 |
| 6609961 | Chemical mechanical planarization belt assembly and method of assembly | John M. Boyd | 2003-08-26 |
| 6599765 | Apparatus and method for providing a signal port in a polishing pad for optical endpoint detection | John M. Boyd | 2003-07-29 |
| 6554688 | Method and apparatus for conditioning a polishing pad with sonic energy | — | 2003-04-29 |
| 6547651 | Subaperture chemical mechanical planarization with polishing pad conditioning | John M. Boyd, David G. Halley | 2003-04-15 |
| 6495464 | Method and apparatus for fixed abrasive substrate preparation and use in a cluster CMP tool | John M. Boyd | 2002-12-17 |