Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7436060 | Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly | Pradip D. Patel, Maurice Othieno, Severino A. Legaspi, Jr. | 2008-10-14 |
| 6933602 | Semiconductor package having a thermally and electrically connected heatspreader | Pradip D. Patel, Maurice Othieno, Severino A. Legaspi, Jr. | 2005-08-23 |
| 6872321 | Direct positive image photo-resist transfer of substrate design | Aritharan Thurairajaratnam, Alejandro Lacap | 2005-03-29 |
| 6867480 | Electromagnetic interference package protection | Severino A. Legaspi, Jr., Maurice Othieno, Pradip D. Patel | 2005-03-15 |
| 6801437 | Electronic organic substrate | Maurice Othieno, Severino A. Legaspi, Jr., Pradip D. Patel | 2004-10-05 |
| 6777803 | Solder mask on bonding ring | Maurice Othieno, Aritharan Thurairajaratnam, Pradip D. Patei, Severino A. Legaspi, Jr. | 2004-08-17 |
| 6603201 | Electronic substrate | Maurice Othieno, Severino A. Legaspi, Jr., Pradip D. Patel | 2003-08-05 |
| 6555914 | Integrated circuit package via | Aritharan Thurairajaratnam, Pradip D. Patel, Hong T. Lim | 2003-04-29 |
| 6117695 | Apparatus and method for testing a flip chip integrated circuit package adhesive layer | Adrian Murphy, Patrick Variot | 2000-09-12 |
| 5998242 | Vacuum assisted underfill process and apparatus for semiconductor package fabrication | Galen Kirkpatrick, Sunil A. Patel, Stephen A. Murphy | 1999-12-07 |
| 5992242 | Silicon wafer or die strength test fixture using high pressure fluid | Adrian Murphy | 1999-11-30 |
| 5949137 | Stiffener ring and heat spreader for use with flip chip packaging assemblies | Ashok Domadia | 1999-09-07 |
| 5886398 | Molded laminate package with integral mold gate | Qwai H. Low, Chok J. Chia, Maniam Alagaratnam | 1999-03-23 |