Issued Patents All Time
Showing 25 most recent of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394728 | Method of forming a region shielding within a package of a microelectronic device | Hong Shen | 2025-08-19 |
| 12040284 | 3D-interconnect with electromagnetic interference (“EMI”) shield and/or antenna | Hong Shen | 2024-07-16 |
| 12021041 | Region shielding within a package of a microelectronic device | Hong Shen | 2024-06-25 |
| 11929337 | 3D-interconnect | Chok J. Chia, Qwai H. Low | 2024-03-12 |
| 11031362 | 3D-interconnect | Chok J. Chia, Qwai H. Low | 2021-06-08 |
| 10181447 | 3D-interconnect | Chok J. Chia, Qwai H. Low | 2019-01-15 |
| 8384205 | Electronic device package and method of manufacture | Qwai H. Low | 2013-02-26 |
| 7993981 | Electronic device package and method of manufacture | Qwai H. Low | 2011-08-09 |
| 6492253 | Method for programming a substrate for array-type packages | Chok J. Chia, Seng-Sooi Lim | 2002-12-10 |
| 6489571 | Molded tape ball grid array package | Chok J. Chia, Qwai H. Low | 2002-12-03 |
| 6297550 | Bondable anodized aluminum heatspreader for semiconductor packages | Chok J. Chia, Maniam Alagaratnam | 2001-10-02 |
| 6143586 | Electrostatic protected substrate | Chok J. Chia, Qwai H. Low | 2000-11-07 |
| 6117695 | Apparatus and method for testing a flip chip integrated circuit package adhesive layer | Adrian Murphy, Manickam Thavarajah | 2000-09-12 |
| 6110815 | Electroplating fixture for high density substrates | Chok J. Chia, Maniam Alagaratnam | 2000-08-29 |
| 6088914 | Method for planarizing an array of solder balls | Chok J. Chia, Robert T. Trabucco | 2000-07-18 |
| 6054767 | Programmable substrate for array-type packages | Chok J. Chia, Seng-Sooi Lim | 2000-04-25 |
| 5989937 | Method for compensating for bottom warpage of a BGA integrated circuit | Chok J. Chia, Robert T. Trabucco | 1999-11-23 |
| 5981311 | Process for using a removeable plating bus layer for high density substrates | Chok J. Chia, Seng-Sooi Lim | 1999-11-09 |
| 5933710 | Method of providing electrical connection between an integrated circuit die and a printed circuit board | Chok J. Chia | 1999-08-03 |
| 5869889 | Thin power tape ball grid array package | Chok J. Chia, Maniam Alagaratnam | 1999-02-09 |
| 5841198 | Ball grid array package employing solid core solder balls | Chok J. Chia, Maniam Alagaratnam | 1998-11-24 |
| 5789811 | Surface mount peripheral leaded and ball grid array package | Chok J. Chia | 1998-08-04 |
| 5745986 | Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage | Chok J. Chia, Robert T. Trabucco | 1998-05-05 |
| 5692296 | Method for encapsulating an integrated circuit package | — | 1997-12-02 |
| 5570272 | Apparatus for encapsulating an integrated circuit package | — | 1996-10-29 |