Issued Patents All Time
Showing 26–31 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5563446 | Surface mount peripheral leaded and ball grid array package | Chok J. Chia | 1996-10-08 |
| 5557150 | Overmolded semiconductor package | Chok J. Chia | 1996-09-17 |
| 5527743 | Method for encapsulating an integrated circuit package | — | 1996-06-18 |
| 5435482 | Integrated circuit having a coplanar solder ball contact array | Chok J. Chia, Robert T. Trabucco | 1995-07-25 |
| 5420752 | GPT system for encapsulating an integrated circuit package | — | 1995-05-30 |
| 5386144 | Snap on heat sink attachment | Qwai H. Low, Maniam Alagaratnam, Teresa Dalao | 1995-01-31 |