| 6088914 |
Method for planarizing an array of solder balls |
Patrick Variot, Chok J. Chia |
2000-07-18 |
| 5989937 |
Method for compensating for bottom warpage of a BGA integrated circuit |
Patrick Variot, Chok J. Chia |
1999-11-23 |
| 5899737 |
Fluxless solder ball attachment process |
— |
1999-05-04 |
| 5761048 |
Conductive polymer ball attachment for grid array semiconductor packages |
— |
1998-06-02 |
| 5745986 |
Method of planarizing an array of plastically deformable contacts on an integrated circuit package to compensate for surface warpage |
Patrick Variot, Chok J. Chia |
1998-05-05 |
| 5610442 |
Semiconductor device package fabrication method and apparatus |
Mark R. Schneider |
1997-03-11 |
| 5465470 |
Fixture for attaching multiple lids to multi-chip module (MCM) integrated circuit |
Sutee Vongfuangfoo |
1995-11-14 |
| 5435482 |
Integrated circuit having a coplanar solder ball contact array |
Patrick Variot, Chok J. Chia |
1995-07-25 |
| 5388327 |
Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package |
— |
1995-02-14 |
| 5381848 |
Casting of raised bump contacts on a substrate |
— |
1995-01-17 |
