Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7119432 | Method and apparatus for establishing improved thermal communication between a die and a heatspreader in a semiconductor package | Kishor Desai | 2006-10-10 |
| 7041516 | Multi chip module assembly | Sarathy Rajagopalan, Kishor Desai, John McCormick | 2006-05-09 |
| 6777314 | Method of forming electrolytic contact pads including layers of copper, nickel, and gold | Kishor Desai, John McCormick | 2004-08-17 |
| 6618938 | Interposer for semiconductor package assembly | Kishor Desai, Sunil A. Patel | 2003-09-16 |
| 6608376 | Integrated circuit package substrate with high density routing mechanism | Wee Liew, Aritharan Thurairajaratnam | 2003-08-19 |
| 6586825 | Dual chip in package with a wire bonded die mounted to a substrate | Sarathy Rajagopalan, Kishor Desai | 2003-07-01 |
| 6433565 | Test fixture for flip chip ball grid array circuits | Kishor Desai, Sunil A. Patel | 2002-08-13 |
| 6429534 | Interposer tape for semiconductor package | Qwai H. Low, Chok J. Chia | 2002-08-06 |
| 6335491 | Interposer for semiconductor package assembly | Kishor Desai, Sunil A. Patel | 2002-01-01 |
| 6297550 | Bondable anodized aluminum heatspreader for semiconductor packages | Chok J. Chia, Patrick Variot | 2001-10-02 |
| 6225695 | Grooved semiconductor die for flip-chip heat sink attachment | Chok J. Chia, Seng-Sooi Lim | 2001-05-01 |
| 6110815 | Electroplating fixture for high density substrates | Chok J. Chia, Patrick Variot | 2000-08-29 |
| 6081997 | System and method for packaging an integrated circuit using encapsulant injection | Chok J. Chia, Seng-Sooi Lim | 2000-07-04 |
| 6057594 | High power dissipating tape ball grid array package | Chok J. Chia, Qwai H. Low | 2000-05-02 |
| 5927505 | Overmolded package body on a substrate | Chok J. Chia, Seng-Sooi Lim | 1999-07-27 |
| 5923047 | Semiconductor die having sacrificial bond pads for die test | Chok J. Chia, Qwai H. Low | 1999-07-13 |
| 5886398 | Molded laminate package with integral mold gate | Qwai H. Low, Manickam Thavarajah, Chok J. Chia | 1999-03-23 |
| 5869889 | Thin power tape ball grid array package | Chok J. Chia, Patrick Variot | 1999-02-09 |
| 5841198 | Ball grid array package employing solid core solder balls | Chok J. Chia, Patrick Variot | 1998-11-24 |
| 5841191 | Ball grid array package employing raised metal contact rings | Chok J. Chia, Qwai H. Low | 1998-11-24 |
| 5814881 | Stacked integrated chip package and method of making same | Qwai H. Low, Chok J. Chia | 1998-09-29 |
| 5744084 | Method of improving molding of an overmolded package body on a substrate | Chok J. Chia, Seng-Sooi Lim | 1998-04-28 |
| 5386144 | Snap on heat sink attachment | Patrick Variot, Qwai H. Low, Teresa Dalao | 1995-01-31 |