Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8889999 | Multiple layer printed circuit board with unplated vias | David Senk | 2014-11-18 |
| 7829424 | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs | Leah M. Miller, Ivor G. Barber | 2010-11-09 |
| 7791210 | Semiconductor package having discrete non-active electrical components incorporated into the package | Leah M. Miller | 2010-09-07 |
| 7508062 | Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs | Leah M. Miller, Ivor G. Barber | 2009-03-24 |
| 7319272 | Ball assignment system | Arun Ramakrishnan, Farshad Ghahghahi, Leah M. Miller | 2008-01-15 |
| 7081672 | Substrate via layout to improve bias humidity testing reliability | Anand Govind, Farshad Ghahghahi | 2006-07-25 |
| 7024637 | Functionality based package design for integrated circuit blocks | Jeffrey A. Hall | 2006-04-04 |
| 6946866 | Measurement of package interconnect impedance using tester and supporting tester | Mohan R. Nagar, Anand Govind, Farshad Ghahghahi | 2005-09-20 |
| 6891392 | Substrate impedance measurement | Mohan R. Nagar | 2005-05-10 |
| 6872321 | Direct positive image photo-resist transfer of substrate design | Manickam Thavarajah, Alejandro Lacap | 2005-03-29 |
| 6825554 | PBGA electrical noise isolation of signal traces | Wee Liew, Nadeem HAQUE | 2004-11-30 |
| 6825066 | Stiffener design | Yogendra Ranade, Anand Govind, Kumar Nagarajan, Farshad Ghahghahi | 2004-11-30 |
| 6791177 | Integrated circuit packaging that uses guard conductors to isolate noise-sensitive signals within the package substrate | Leah M. Miller, Edwin M. Fulcher | 2004-09-14 |
| 6777803 | Solder mask on bonding ring | Maurice Othieno, Manickam Thavarajah, Pradip D. Patei, Severino A. Legaspi, Jr. | 2004-08-17 |
| 6744130 | Isolated stripline structure | Leah M. Miller, Edwin M. Fulcher | 2004-06-01 |
| 6717423 | Substrate impedance measurement | Mohan R. Nagar | 2004-04-06 |
| 6608376 | Integrated circuit package substrate with high density routing mechanism | Wee Liew, Maniam Alagaratnam | 2003-08-19 |
| 6566167 | PBGA electrical noise isolation of signal traces | Wee Liew, Nadeem HAQUE | 2003-05-20 |
| 6555914 | Integrated circuit package via | Pradip D. Patel, Manickam Thavarajah, Hong T. Lim | 2003-04-29 |
| 6534968 | Integrated circuit test vehicle | Leah M. Miller, Anand Govind, Zafer Kutlu, Chao-Wen Chung | 2003-03-18 |
| 6531932 | Microstrip package having optimized signal line impedance control | Anand Govind, Farshad Ghahghahi | 2003-03-11 |
| 6496081 | Transmission equalization system and an integrated circuit package employing the same | Anand Govind | 2002-12-17 |
| 6459049 | High density signal routing | Leah M. Miller, Farshad Ghahghahi, Edwin M. Fulcher | 2002-10-01 |
| 6396140 | Single reference plane plastic ball grid array package | Nitin Juneja | 2002-05-28 |
| 6225690 | Plastic ball grid array package with strip line configuration | Nitin Juneja | 2001-05-01 |