Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9320183 | Ground lid opening on a substrate | — | 2016-04-19 |
| 8962388 | Method and apparatus for supporting a computer chip on a printed circuit board assembly | Kuo-Chuan Liu, Mudasir Ahmad, Bangalore J. Shanker, Jie Xue | 2015-02-24 |
| 8952523 | Integrated circuit package lid configured for package coplanarity | Mudasir Ahmad, Weidong Xie | 2015-02-10 |
| 8736044 | Lid for an electrical hardware component | Mudasir Ahmad, Kuo-Chuan Liu, Bangalore J. Shanker | 2014-05-27 |
| 8081484 | Method and apparatus for supporting a computer chip on a printed circuit board assembly | Kuo-Chuan Liu, Mudasir Ahmad, Bangalore J. Shanker, Jie Xue | 2011-12-20 |
| 7641776 | System and method for increasing yield from semiconductor wafer electroplating | Shirish Shah | 2010-01-05 |
| 7352062 | Integrated circuit package design | Mukul Joshi, Sarathy Rajagopalan | 2008-04-01 |
| 6946866 | Measurement of package interconnect impedance using tester and supporting tester | Aritharan Thurairajaratnam, Anand Govind, Farshad Ghahghahi | 2005-09-20 |
| 6891392 | Substrate impedance measurement | Aritharan Thurairajaratnam | 2005-05-10 |
| 6825556 | Integrated circuit package design with non-orthogonal die cut out | Mukul Joshi, Sarathy Rajagopalan | 2004-11-30 |
| 6717423 | Substrate impedance measurement | Aritharan Thurairajaratnam | 2004-04-06 |
| 6605954 | Reducing probe card substrate warpage | — | 2003-08-12 |