Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11625727 | Dispute resolution system interface | Savitha Ajitraj, Manickkam Pandian, Padmini Janaki, Ramaguru Ramasubbu, Rashmi Prakash +5 more | 2023-04-11 |
| 7352062 | Integrated circuit package design | Mukul Joshi, Mohan R. Nagar | 2008-04-01 |
| 7041516 | Multi chip module assembly | Kishor Desai, John McCormick, Maniam Alagaratnam | 2006-05-09 |
| 6962437 | Method and apparatus for thermal profiling of flip-chip packages | Minh Vuong | 2005-11-08 |
| 6825556 | Integrated circuit package design with non-orthogonal die cut out | Mukul Joshi, Mohan R. Nagar | 2004-11-30 |
| 6586825 | Dual chip in package with a wire bonded die mounted to a substrate | Kishor Desai, Maniam Alagaratnam | 2003-07-01 |
| 6518161 | Method for manufacturing a dual chip in package with a flip chip die mounted on a wire bonded die | Kishor Desai | 2003-02-11 |
| 6465338 | Method of planarizing die solder balls by employing a die's weight | Kishor Desai, Zafer Kutlu | 2002-10-15 |
| 6441499 | Thin form factor flip chip ball grid array | Kumar Nagarajan | 2002-08-27 |
| 6320127 | Method and structure for reducing the incidence of voiding in an underfill layer of an electronic component package | Kumar Nagarajan | 2001-11-20 |