Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7345245 | Robust high density substrate design for thermal cycling reliability | Zafer Kutlu, Farshad Ghahghahi | 2008-03-18 |
| 7105926 | Routing scheme for differential pairs in flip chip substrates | Arun Ramakrishnan, Farshad Ghahghahi | 2006-09-12 |
| 7095107 | Ball assignment schemes for integrated circuit packages | Arun Ramakrishnan | 2006-08-22 |
| 7081672 | Substrate via layout to improve bias humidity testing reliability | Aritharan Thurairajaratnam, Farshad Ghahghahi | 2006-07-25 |
| 6946866 | Measurement of package interconnect impedance using tester and supporting tester | Aritharan Thurairajaratnam, Mohan R. Nagar, Farshad Ghahghahi | 2005-09-20 |
| 6825066 | Stiffener design | Yogendra Ranade, Kumar Nagarajan, Farshad Ghahghahi, Aritharan Thurairajaratnam | 2004-11-30 |
| 6759921 | Characteristic impedance equalizer and an integrated circuit package employing the same | Yogendra Ranade | 2004-07-06 |
| 6701270 | Method for reliability testing leakage characteristics in an electronic circuit and a testing device for accomplishing the source | Leah M. Miller | 2004-03-02 |
| 6700207 | Flip-chip ball grid array package for electromigration testing | Senol Pekin, Carl Iwashita | 2004-03-02 |
| 6534968 | Integrated circuit test vehicle | Leah M. Miller, Zafer Kutlu, Chao-Wen Chung, Aritharan Thurairajaratnam | 2003-03-18 |
| 6531932 | Microstrip package having optimized signal line impedance control | Farshad Ghahghahi, Aritharan Thurairajaratnam | 2003-03-11 |
| 6496081 | Transmission equalization system and an integrated circuit package employing the same | Aritharan Thurairajaratnam | 2002-12-17 |