Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222745 | Integrated heat sink | SangJune Park | 2012-07-17 |
| 6700207 | Flip-chip ball grid array package for electromigration testing | Senol Pekin, Anand Govind | 2004-03-02 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8222745 | Integrated heat sink | SangJune Park | 2012-07-17 |
| 6700207 | Flip-chip ball grid array package for electromigration testing | Senol Pekin, Anand Govind | 2004-03-02 |