Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7436060 | Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly | Pradip D. Patel, Maurice Othieno, Manickam Thavarajah | 2008-10-14 |
| 6933602 | Semiconductor package having a thermally and electrically connected heatspreader | Pradip D. Patel, Maurice Othieno, Manickam Thavarajah | 2005-08-23 |
| 6867480 | Electromagnetic interference package protection | Manickam Thavarajah, Maurice Othieno, Pradip D. Patel | 2005-03-15 |
| 6801437 | Electronic organic substrate | Maurice Othieno, Manickam Thavarajah, Pradip D. Patel | 2004-10-05 |
| 6777803 | Solder mask on bonding ring | Maurice Othieno, Aritharan Thurairajaratnam, Manickam Thavarajah, Pradip D. Patei | 2004-08-17 |
| 6603201 | Electronic substrate | Manickam Thavarajah, Maurice Othieno, Pradip D. Patel | 2003-08-05 |