| 9372264 |
Proximity sensor device |
Ajay Kumar Ghai, Steven D. Cate |
2016-06-21 |
| 9368466 |
Bump I/O contact for semiconductor device |
— |
2016-06-14 |
| 8822925 |
Proximity sensor device |
Ajay Kumar Ghai, Steven D. Cate |
2014-09-02 |
| 8604436 |
Proximity sensor device |
Ajay Kumar Ghai, Steve Detlev Cate |
2013-12-10 |
| 8269345 |
Bump I/O contact for semiconductor device |
— |
2012-09-18 |
| 7436060 |
Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly |
Maurice Othieno, Manickam Thavarajah, Severino A. Legaspi, Jr. |
2008-10-14 |
| 6933602 |
Semiconductor package having a thermally and electrically connected heatspreader |
Maurice Othieno, Manickam Thavarajah, Severino A. Legaspi, Jr. |
2005-08-23 |
| 6867480 |
Electromagnetic interference package protection |
Severino A. Legaspi, Jr., Manickam Thavarajah, Maurice Othieno |
2005-03-15 |
| 6801437 |
Electronic organic substrate |
Maurice Othieno, Manickam Thavarajah, Severino A. Legaspi, Jr. |
2004-10-05 |
| 6603201 |
Electronic substrate |
Manickam Thavarajah, Maurice Othieno, Severino A. Legaspi, Jr. |
2003-08-05 |
| 6555914 |
Integrated circuit package via |
Aritharan Thurairajaratnam, Manickam Thavarajah, Hong T. Lim |
2003-04-29 |
| 5541524 |
Burn-in technologies for unpackaged integrated circuits |
David B. Tuckerman |
1996-07-30 |
| 5397997 |
Burn-in technologies for unpackaged integrated circuits |
David B. Tuckerman |
1995-03-14 |
