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Enhanced pad design for solder attach devices |
Ramaswamy Ranganathan, Frederick E. Beville, David Alan Pruitt, William D. Griffitts |
2012-04-24 |
| 8129759 |
Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolation |
Chok J. Chia, Amar Amin |
2012-03-06 |
| 7804167 |
Wire bond integrated circuit package for high speed I/O |
Clifford R. Fishley, Abiola Awujoola, Leonard L. Mora, Amar Amin, Chok J. Chia |
2010-09-28 |
| 7646091 |
Semiconductor package and method using isolated Vss plane to accommodate high speed circuitry ground isolation |
Chok J. Chia, Amar Amin |
2010-01-12 |
| 7436060 |
Semiconductor package and process utilizing pre-formed mold cap and heatspreader assembly |
Pradip D. Patel, Manickam Thavarajah, Severino A. Legaspi, Jr. |
2008-10-14 |
| 7420809 |
Heat spreader in integrated circuit package |
Hong T. Lim, Qwai H. Low |
2008-09-02 |
| 7327043 |
Two layer substrate ball grid array design |
Chok J. Chia, Allen S. Lim |
2008-02-05 |
| 7235889 |
Integrated heatspreader for use in wire bonded ball grid array semiconductor packages |
Hong T. Lim, Qwai H. Low |
2007-06-26 |
| 6933602 |
Semiconductor package having a thermally and electrically connected heatspreader |
Pradip D. Patel, Manickam Thavarajah, Severino A. Legaspi, Jr. |
2005-08-23 |
| 6867480 |
Electromagnetic interference package protection |
Severino A. Legaspi, Jr., Manickam Thavarajah, Pradip D. Patel |
2005-03-15 |
| 6825563 |
Slotted bonding pad |
Ramaswamy Ranganathan, Qwai H. Low |
2004-11-30 |
| 6801437 |
Electronic organic substrate |
Manickam Thavarajah, Severino A. Legaspi, Jr., Pradip D. Patel |
2004-10-05 |
| 6777803 |
Solder mask on bonding ring |
Aritharan Thurairajaratnam, Manickam Thavarajah, Pradip D. Patei, Severino A. Legaspi, Jr. |
2004-08-17 |
| 6654248 |
Top gated heat dissipation |
Clifford R. Fishley |
2003-11-25 |
| 6603201 |
Electronic substrate |
Manickam Thavarajah, Severino A. Legaspi, Jr., Pradip D. Patel |
2003-08-05 |
