Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749576 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, David R. Ng, Michael J. Anderson, Yucheng Ying | 2023-09-05 |
| 11410977 | Electronic module for high power applications | John David Brazzle, Yucheng Ying, Zafer Kutlu | 2022-08-09 |
| 11272618 | Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits | John David Brazzle, David Alan Pruitt | 2022-03-08 |
| 10497635 | Stacked circuit package with molded base having laser drilled openings for upper package | John David Brazzle, David R. Ng, Michael J. Anderson, Yucheng Ying | 2019-12-03 |
| 8163643 | Enhanced pad design for solder attach devices | Maurice Othieno, Ramaswamy Ranganathan, David Alan Pruitt, William D. Griffitts | 2012-04-24 |