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| 11272618 |
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| 8921159 |
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— |
2014-12-30 |
| 8492884 |
Stacked interposer leadframes |
— |
2013-07-23 |
| 8269355 |
Flexible contactless wire bonding structure and methodology for semiconductor device |
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2012-09-18 |
| 8163643 |
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2012-04-24 |
| 8076181 |
Lead plating technique for singulated IC packages |
Lothar Maier |
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| 7960845 |
Flexible contactless wire bonding structure and methodology for semiconductor device |
— |
2011-06-14 |
| 7902665 |
Semiconductor device having a suspended isolating interconnect |
— |
2011-03-08 |
| 7414302 |
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— |
2008-08-19 |
| 7154165 |
Flashless lead frame with horizontal singulation |
— |
2006-12-26 |
| 6703692 |
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— |
2004-03-09 |
| 5518684 |
Method of making a molded lead frame |
— |
1996-05-21 |