Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296019 | Vertically structured pad system | Kwang Hong Tan, Mihalis Michael | 2022-04-05 |
| 11272618 | Mechanically-compliant and electrically and thermally conductive leadframes for component-on-package circuits | John David Brazzle, Frederick E. Beville | 2022-03-08 |
| 8921159 | Stacked interposer leadframes | — | 2014-12-30 |
| 8492884 | Stacked interposer leadframes | — | 2013-07-23 |
| 8269355 | Flexible contactless wire bonding structure and methodology for semiconductor device | — | 2012-09-18 |
| 8163643 | Enhanced pad design for solder attach devices | Maurice Othieno, Ramaswamy Ranganathan, Frederick E. Beville, William D. Griffitts | 2012-04-24 |
| 8076181 | Lead plating technique for singulated IC packages | Lothar Maier | 2011-12-13 |
| 7960845 | Flexible contactless wire bonding structure and methodology for semiconductor device | — | 2011-06-14 |
| 7902665 | Semiconductor device having a suspended isolating interconnect | — | 2011-03-08 |
| 7414302 | Flashless lead frame with horizontal singulation | — | 2008-08-19 |
| 7154165 | Flashless lead frame with horizontal singulation | — | 2006-12-26 |
| 6703692 | Leadframe with support members | — | 2004-03-09 |
| 5518684 | Method of making a molded lead frame | — | 1996-05-21 |