Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296019 | Vertically structured pad system | Mihalis Michael, David Alan Pruitt | 2022-04-05 |
| 10748845 | Power management application of interconnect substrates | Mihalis Michael, Ilija Jergovic, Chiteh Chiang, Anthony J. Stratakos | 2020-08-18 |
| 10332827 | Power management application of interconnect substrates | Mihalis Michael, Ilija Jergovic, Chiteh Chiang, Anthony J. Stratakos | 2019-06-25 |
| 9520342 | Power management applications of interconnect substrates | Mihalis Michael, Ilija Jergovic, Chiteh Chiang, Anthony J. Stratakos | 2016-12-13 |
| 9099340 | Power management applications of interconnect substrates | Mihalis Michael, Ilija Jergovic, Chiteh Chiang, Anthony J. Stratakos | 2015-08-04 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Chong Pei Andrew Lim +4 more | 2006-09-26 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Chong Pei Andrew Lim +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Chong Pei Andrew Lim +4 more | 2004-02-17 |