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Method of manufacturing microelectronic devices, related tools and apparatus |
Suresh Upadhyayula |
2022-03-22 |
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Methods of reconstructing skulls |
Shudong Xie, Wee Kheng Leow |
2021-03-02 |
| 10115715 |
Methods of making semiconductor device packages and related semiconductor device packages |
— |
2018-10-30 |
| 9673183 |
Methods of making semiconductor device packages and related semiconductor device packages |
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2017-06-06 |
| 9492279 |
Bioabsorbable plug implants and method for bone tissue regeneration |
Swee Hin Teoh, Kim Cheng Tan, Dietmar Werner Hutmacher, Jan-Thorsten Schantz, Ning Chou |
2016-11-15 |
| 8373277 |
Stacked die in die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2013-02-12 |
| 7799610 |
Method of fabricating a stacked die having a recess in a die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2010-09-21 |
| 7575953 |
Stacked die with a recess in a die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2009-08-18 |
| 7371608 |
Method of fabricating a stacked die having a recess in a die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2008-05-13 |
| 7358117 |
Stacked die in die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2008-04-15 |
| 7344969 |
Stacked die in die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2008-03-18 |
| 7332819 |
Stacked die in die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2008-02-19 |
| 7332820 |
Stacked die in die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2008-02-19 |
| 7309623 |
Method of fabricating a stacked die in die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2007-12-18 |
| 7282392 |
Method of fabricating a stacked die in die BGA package |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2007-10-16 |
| 7282390 |
Stacked die-in-die BGA package with die having a recess |
Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more |
2007-10-16 |
| 7259451 |
Invertible microfeature device packages |
Eric Tan Swee Seng |
2007-08-21 |
| 7112048 |
BOC BGA package for die with I-shaped bond pad layout |
Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more |
2006-09-26 |
| 6720666 |
BOC BGA package for die with I-shaped bond pad layout |
Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more |
2004-04-13 |
| 6692987 |
BOC BGA package for die with I-shaped bond pad layout |
Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more |
2004-02-17 |
