Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11282746 | Method of manufacturing microelectronic devices, related tools and apparatus | Suresh Upadhyayula | 2022-03-22 |
| 10937250 | Methods of reconstructing skulls | Shudong Xie, Wee Kheng Leow | 2021-03-02 |
| 10115715 | Methods of making semiconductor device packages and related semiconductor device packages | — | 2018-10-30 |
| 9673183 | Methods of making semiconductor device packages and related semiconductor device packages | — | 2017-06-06 |
| 9492279 | Bioabsorbable plug implants and method for bone tissue regeneration | Swee Hin Teoh, Kim Cheng Tan, Dietmar Werner Hutmacher, Jan-Thorsten Schantz, Ning Chou | 2016-11-15 |
| 8373277 | Stacked die in die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2013-02-12 |
| 7799610 | Method of fabricating a stacked die having a recess in a die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2010-09-21 |
| 7575953 | Stacked die with a recess in a die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2009-08-18 |
| 7371608 | Method of fabricating a stacked die having a recess in a die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2008-05-13 |
| 7358117 | Stacked die in die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2008-04-15 |
| 7344969 | Stacked die in die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2008-03-18 |
| 7332819 | Stacked die in die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2008-02-19 |
| 7332820 | Stacked die in die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2008-02-19 |
| 7309623 | Method of fabricating a stacked die in die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2007-12-18 |
| 7282392 | Method of fabricating a stacked die in die BGA package | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2007-10-16 |
| 7282390 | Stacked die-in-die BGA package with die having a recess | Hock Chuan Tan, Victor Tan, Chee Peng Neo, Michael Tan, Beng Chye Chew +1 more | 2007-10-16 |
| 7259451 | Invertible microfeature device packages | Eric Tan Swee Seng | 2007-08-21 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout | Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2006-09-26 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-02-17 |