| 8476109 |
Semiconductor workpiece carriers and methods for processing semiconductor workpieces |
Hong Hak Teo, Jamilon Bin Sukami |
2013-07-02 |
| 8373277 |
Stacked die in die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2013-02-12 |
| 8011513 |
Semiconductor workpiece carriers and methods for processing semiconductor workpieces |
Hong Hak Teo, Jamilon Bin Sukami |
2011-09-06 |
| 7799610 |
Method of fabricating a stacked die having a recess in a die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2010-09-21 |
| 7691680 |
Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Hock Chuan Tan, Beng Chye Chew, Yih Ming Chai, Kian Shing Tan |
2010-04-06 |
| 7575953 |
Stacked die with a recess in a die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2009-08-18 |
| 7371608 |
Method of fabricating a stacked die having a recess in a die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2008-05-13 |
| 7358117 |
Stacked die in die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2008-04-15 |
| 7344969 |
Stacked die in die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2008-03-18 |
| 7332819 |
Stacked die in die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2008-02-19 |
| 7332820 |
Stacked die in die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2008-02-19 |
| 7309623 |
Method of fabricating a stacked die in die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2007-12-18 |
| 7282392 |
Method of fabricating a stacked die in die BGA package |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2007-10-16 |
| 7282390 |
Stacked die-in-die BGA package with die having a recess |
Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Michael Tan, Beng Chye Chew +1 more |
2007-10-16 |
| 7213447 |
Method and apparatus for detecting topographical features of microelectronic substrates |
Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan |
2007-05-08 |
| 6923045 |
Method and apparatus for detecting topographical features of microelectronic substrates |
Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan |
2005-08-02 |
| 6779386 |
Method and apparatus for detecting topographical features of microelectronic substrates |
Cher Khng Victor Tan, Kian Seng Ho, Hock Chuan Tan |
2004-08-24 |
