Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7691680 | Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths | Chee Peng Neo, Hock Chuan Tan, Beng Chye Chew, Kian Shing Tan | 2010-04-06 |