Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7691680 | Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengths | Chee Peng Neo, Hock Chuan Tan, Beng Chye Chew, Yih Ming Chai | 2010-04-06 |
| 6737606 | Wafer dicing device and method | Neo Chee Peng, Chew Beng Chye, Tan Hock Chuan, Fong Chun Wai | 2004-05-18 |