| 8058716 |
Integrated circuit devices with stacked package interposers |
Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng |
2011-11-15 |
| 7622798 |
Integrated circuit devices with stacked package interposers |
Tan Kian Shing Michael, Tan Hock Chuan, Neo Chee Peng |
2009-11-24 |
| 7425470 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Neo Chee Peng, Tan Hock Chuan, David Chai Yih Ming, Michael Tan Kian Shing |
2008-09-16 |
| 7057281 |
Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths |
Neo Chee Peng, Tan Hock Chuan, David Chai Yih Ming, Michael Tan Kian Shing |
2006-06-06 |
| 7018270 |
Method and apparatus for cutting semiconductor wafers |
Neo Chee Peng, Tan Hock Chuan, Ho Seng, Lim Guek Har, Tan Chua |
2006-03-28 |
| 6939199 |
Method and apparatus for cutting semiconductor wafers |
Neo Chee Peng, Tan Hock Chuan, Ho Seng, Lim Guek Har, Tan Chua |
2005-09-06 |
| 6737606 |
Wafer dicing device and method |
Neo Chee Peng, Kian Shing Tan, Tan Hock Chuan, Fong Chun Wai |
2004-05-18 |
| 6576531 |
Method for cutting semiconductor wafers |
Neo Chee Peng, Tan Hock Chuan, Ho Seng, Lim Guek Har, Tan Chua |
2003-06-10 |
