Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7018270 | Method and apparatus for cutting semiconductor wafers | Neo Chee Peng, Tan Hock Chuan, Ho Seng, Chew Beng Chye, Tan Chua | 2006-03-28 |
| 6939199 | Method and apparatus for cutting semiconductor wafers | Neo Chee Peng, Tan Hock Chuan, Ho Seng, Chew Beng Chye, Tan Chua | 2005-09-06 |
| 6576531 | Method for cutting semiconductor wafers | Neo Chee Peng, Tan Hock Chuan, Ho Seng, Chew Beng Chye, Tan Chua | 2003-06-10 |