Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7425470 | Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths | Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, Michael Tan Kian Shing | 2008-09-16 |
| 7057281 | Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths | Neo Chee Peng, Tan Hock Chuan, Chew Beng Chye, Michael Tan Kian Shing | 2006-06-06 |