Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
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Michael Tan — 15 Patents

Micron: 15 patents #1,121 of 6,374Top 20%
Singapore, SG: #440 of 13,971 inventorsTop 4%
Overall (All Time): #307,048 of 4,157,543Top 8%
15 Patents All Time
Michael Tan has been granted 15 US patents while listed as an inventor at Micron. The first was granted in 2007 and the most recent in January 2021. Michael Tan ranks #307,048 of 4,157,543 US inventors in our database (top 7.4%). Patent records list Michael Tan in Singapore, SG.

Issued Patents All Time

Showing 1–15 of 15 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
10892202 External gettering method and device Cheng Poh Pour 2021-01-12 $27,723,000
10453761 External gettering method and device Cheng Poh Pour 2019-10-22 $18,519,000
9543166 External gettering method and device Cheng Poh Pour 2017-01-10 $21,748,000
9177828 External gettering method and device Cheng Poh Pour 2015-11-03 $7,896,000
8373277 Stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2013-02-12 $3,769,000
7799610 Method of fabricating a stacked die having a recess in a die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2010-09-21 $4,569,000
7575953 Stacked die with a recess in a die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2009-08-18 $5,074,000
7371608 Method of fabricating a stacked die having a recess in a die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2008-05-13 $1,487,000
7358117 Stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2008-04-15 $1,839,000
7344969 Stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2008-03-18 $1,356,000
7332820 Stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2008-02-19 $1,423,000
7332819 Stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2008-02-19 $1,423,000
7309623 Method of fabricating a stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2007-12-18 $4,095,000
7282390 Stacked die-in-die BGA package with die having a recess Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2007-10-16 $1,318,000
7282392 Method of fabricating a stacked die in die BGA package Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Beng Chye Chew +1 more 2007-10-16 $1,318,000