Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892202 | External gettering method and device | Michael Tan | 2021-01-12 |
| 10453761 | External gettering method and device | Michael Tan | 2019-10-22 |
| 9543166 | External gettering method and device | Michael Tan | 2017-01-10 |
| 9177828 | External gettering method and device | Michael Tan | 2015-11-03 |
| 8373277 | Stacked die in die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2013-02-12 |
| 7799610 | Method of fabricating a stacked die having a recess in a die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2010-09-21 |
| 7575953 | Stacked die with a recess in a die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2009-08-18 |
| 7371608 | Method of fabricating a stacked die having a recess in a die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2008-05-13 |
| 7358117 | Stacked die in die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2008-04-15 |
| 7344969 | Stacked die in die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2008-03-18 |
| 7332819 | Stacked die in die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2008-02-19 |
| 7332820 | Stacked die in die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2008-02-19 |
| 7309623 | Method of fabricating a stacked die in die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2007-12-18 |
| 7282392 | Method of fabricating a stacked die in die BGA package | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2007-10-16 |
| 7282390 | Stacked die-in-die BGA package with die having a recess | Hock Chuan Tan, Thiam Chye Lim, Victor Tan, Chee Peng Neo, Michael Tan +1 more | 2007-10-16 |
| 7061124 | Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks | Cher Khng Victor Tan, Choon Kuan Lee, Kian Lee, Guek Har Lim, Wuu Yean Tay +1 more | 2006-06-13 |