Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8084846 | Balanced semiconductor device packages including lead frame with floating leads and associated methods | Teck Kheng Lee, Vanessa Chong Hui Van | 2011-12-27 |
| 7915718 | Apparatus for flip-chip packaging providing testing capability | Teck Kheng Lee, Wuu Yean Tay | 2011-03-29 |
| 7368391 | Methods for designing carrier substrates with raised terminals | Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2008-05-06 |
| 7320933 | Double bumping of flexible substrate for first and second level interconnects | Teck Kheng Lee, Sian Yong Khoo | 2008-01-22 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2006-09-26 |
| 7061124 | Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks | Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2006-06-13 |
| 7018871 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods | Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2006-03-28 |
| 7005316 | Method for package reduction in stacked chip and board assemblies | Teck Kheng Lee | 2006-02-28 |
| 6787917 | Apparatus for package reduction in stacked chip and board assemblies | Teck Kheng Lee | 2004-09-07 |
| 6787923 | Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks | Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more | 2004-09-07 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more | 2004-02-17 |
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Teoh Bee Yong Tim, Vijendran M, Lien Wah Choong | 2003-12-02 |
| 6583502 | Apparatus for package reduction in stacked chip and board assemblies | Teck Kheng Lee | 2003-06-24 |