| 8084846 |
Balanced semiconductor device packages including lead frame with floating leads and associated methods |
Teck Kheng Lee, Vanessa Chong Hui Van |
2011-12-27 |
| 7915718 |
Apparatus for flip-chip packaging providing testing capability |
Teck Kheng Lee, Wuu Yean Tay |
2011-03-29 |
| 7368391 |
Methods for designing carrier substrates with raised terminals |
Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more |
2008-05-06 |
| 7320933 |
Double bumping of flexible substrate for first and second level interconnects |
Teck Kheng Lee, Sian Yong Khoo |
2008-01-22 |
| 7112048 |
BOC BGA package for die with I-shaped bond pad layout |
Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more |
2006-09-26 |
| 7061124 |
Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks |
Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more |
2006-06-13 |
| 7018871 |
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods |
Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more |
2006-03-28 |
| 7005316 |
Method for package reduction in stacked chip and board assemblies |
Teck Kheng Lee |
2006-02-28 |
| 6787917 |
Apparatus for package reduction in stacked chip and board assemblies |
Teck Kheng Lee |
2004-09-07 |
| 6787923 |
Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks |
Cher Khng Victor Tan, Choon Kuan Lee, Guek Har Lim, Wuu Yean Tay, Teck Huat Poh +1 more |
2004-09-07 |
| 6720666 |
BOC BGA package for die with I-shaped bond pad layout |
Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more |
2004-04-13 |
| 6692987 |
BOC BGA package for die with I-shaped bond pad layout |
Thiam Chye Lim, Kay Kit Tan, Victor Tan, Kwang Hong Tan, Chong Pei Andrew Lim +4 more |
2004-02-17 |
| 6656769 |
Method and apparatus for distributing mold material in a mold for packaging microelectronic devices |
Teoh Bee Yong Tim, Vijendran M, Lien Wah Choong |
2003-12-02 |
| 6583502 |
Apparatus for package reduction in stacked chip and board assemblies |
Teck Kheng Lee |
2003-06-24 |
