Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Kian Lee, Teoh Bee Yong Tim, Lien Wah Choong | 2003-12-02 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Kian Lee, Teoh Bee Yong Tim, Lien Wah Choong | 2003-12-02 |