Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Kian Lee, Teoh Bee Yong Tim, Lien Wah Choong | 2003-12-02 |
VM
Vijendran M
Overall (All Time): #3,530,277 of 4,157,543Top 85%
1
Patents All Time