Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6656769 | Method and apparatus for distributing mold material in a mold for packaging microelectronic devices | Kian Lee, Vijendran M, Lien Wah Choong | 2003-12-02 |
TT
Teoh Bee Yong Tim
Overall (All Time): #3,530,276 of 4,157,543Top 85%
1
Patents All Time