Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7320933 | Double bumping of flexible substrate for first and second level interconnects | Teck Kheng Lee, Kian Lee | 2008-01-22 |
| 7112048 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2006-09-26 |
| 6720666 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2004-04-13 |
| 6692987 | BOC BGA package for die with I-shaped bond pad layout | Thiam Chye Lim, Kay Kit Tan, Kian Lee, Victor Tan, Kwang Hong Tan +4 more | 2004-02-17 |
| 5956233 | High density single inline memory module | Chee Kiang Yew, Kian Teng Eng, Bok Leng Ser | 1999-09-21 |