Issued Patents All Time
Showing 25 most recent of 68 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10515918 | Methods of fluxless micro-piercing of solder balls, and resulting devices | — | 2019-12-24 |
| 10163840 | Methods of fluxless micro-piercing of solder balls, and resulting devices | — | 2018-12-25 |
| 9806013 | Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device | Bok Leng Ser | 2017-10-31 |
| 9412677 | Computer systems having an interposer including a flexible material | — | 2016-08-09 |
| 9153526 | Microelectronic devices and methods for manufacturing microelectronic devices | — | 2015-10-06 |
| 9129862 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | David Yih Ming Chai, Hong Wan Ng | 2015-09-08 |
| 8778732 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | David Yih Ming Chai, Hong Wan Ng | 2014-07-15 |
| 8742572 | Microelectronic devices and methods for manufacturing microelectronic devices | — | 2014-06-03 |
| 8669173 | Methods of fluxless micro-piercing of solder balls, and resulting devices | — | 2014-03-11 |
| 8604598 | Microelectronic devices and methods for manufacturing microelectronic devices | — | 2013-12-10 |
| 8536046 | Partitioned through-layer via and associated systems and methods | — | 2013-09-17 |
| 8441113 | Elimination of RDL using tape base flip chip on flex for die stacking | — | 2013-05-14 |
| 8436478 | Methods of fluxless micro-piercing of solder balls, and resulting devices | — | 2013-05-07 |
| 8367538 | Partitioned through-layer via and associated systems and methods | — | 2013-02-05 |
| 8310048 | Microelectronic devices | — | 2012-11-13 |
| 8283761 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Voon Siong Chin, Ai Chie Wang | 2012-10-09 |
| 8269326 | Semiconductor device assemblies | — | 2012-09-18 |
| 8174101 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | David Yih Ming Chai, Hong Wan Ng | 2012-05-08 |
| 8125065 | Elimination of RDL using tape base flip chip on flex for die stacking | — | 2012-02-28 |
| 8101464 | Microelectronic devices and methods for manufacturing microelectronic devices | — | 2012-01-24 |
| 8084846 | Balanced semiconductor device packages including lead frame with floating leads and associated methods | Kian Lee, Vanessa Chong Hui Van | 2011-12-27 |
| 7968376 | Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices | Voon Siong Chin, Ai Chie Wang | 2011-06-28 |
| 7968369 | Microelectronic devices and microelectronic support devices, and associated assemblies and methods | David Yih Ming Chai, Hong Wan Ng | 2011-06-28 |
| 7915718 | Apparatus for flip-chip packaging providing testing capability | Wuu Yean Tay, Kian Lee | 2011-03-29 |
| 7902648 | Interposer configured to reduce the profiles of semiconductor device assemblies, packages including the same, and methods | — | 2011-03-08 |