Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9806013 | Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device | Teck Kheng Lee | 2017-10-31 |
| 9418872 | Packaged microelectronic components | Meow Koon Eng, Sui Waf Low, Min Yu Chan, Yong Poo Chia, Wei Zhou | 2016-08-16 |
| 8698295 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Yong Loo Neo | 2014-04-15 |
| 8304894 | Super high-density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Yong Loo Neo | 2012-11-06 |
| 7884007 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Yong Loo Neo | 2011-02-08 |
| 7579681 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Yong Loo Neo | 2009-08-25 |
| 7368374 | Super high density module with integrated wafer level packages | Yong Poo Chia, Suan Jeung Boon, Siu Waf Low, Yong Loo Neo | 2008-05-06 |
| 5956233 | High density single inline memory module | Chee Kiang Yew, Kian Teng Eng, Sian Yong Khoo | 1999-09-21 |