Issued Patents All Time
Showing 25 most recent of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10622308 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Yong Poo Chia | 2020-04-14 |
| 10396059 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2019-08-27 |
| 10056359 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2018-08-21 |
| 9911696 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Yong Poo Chia | 2018-03-06 |
| 9653444 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2017-05-16 |
| 9418872 | Packaged microelectronic components | Sui Waf Low, Min Yu Chan, Yong Poo Chia, Bok Leng Ser, Wei Zhou | 2016-08-16 |
| 9165910 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2015-10-20 |
| 8906744 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2014-12-09 |
| 8536702 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2013-09-17 |
| 8525320 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon, Wuu Yean Tay | 2013-09-03 |
| 8445330 | Interconnects for packaged semiconductor devices and methods for manufacturing such devices | Suan Jeung Boon, Yong Poo Chia | 2013-05-21 |
| 8232657 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Yong Poo Chia | 2012-07-31 |
| 8198720 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2012-06-12 |
| 8063493 | Semiconductor device assemblies and packages | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low | 2011-11-22 |
| 7855462 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Suan Jeung Boon, Yong Poo Chia | 2010-12-21 |
| 7843050 | Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods | Yong Poo Chia, Suan Jeung Boon | 2010-11-30 |
| 7791203 | Interconnects for packaged semiconductor devices and methods for manufacturing such devices | Suan Jeung Boon, Yong Poo Chia | 2010-09-07 |
| 7659134 | Microelectronic imagers and methods for manufacturing such microelectronic imagers | Yong Poo Chia, Yong Loo Neo | 2010-02-09 |
| 7633159 | Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low | 2009-12-15 |
| 7553697 | Multiple chip semiconductor package | Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low, Swee Kwang Chua +1 more | 2009-06-30 |
| 7485562 | Method of making multichip wafer level packages and computing systems incorporating same | Swee Kwang Chua, Siu Waf Low, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon +2 more | 2009-02-03 |
| 7304375 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Swee Kwang Chua, Shuang Wu Huang +2 more | 2007-12-04 |
| 7271027 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Swee Chua, Shuang Wu Huang +2 more | 2007-09-18 |
| 7208335 | Castellated chip-scale packages and methods for fabricating the same | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low | 2007-04-24 |
| 7193312 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Swee Kwang Chua, Shuang Wu Huang +2 more | 2007-03-20 |