Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8669657 | Stackable semiconductor assemblies and methods of manufacturing such assemblies | — | 2014-03-11 |
| 8564106 | Wafer level packaging | Suan Jeung Boon, Yong Poo Chia, Yong Loo Neo | 2013-10-22 |
| 8555495 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Eng Meow Koon | 2013-10-15 |
| 8518747 | Stackable semiconductor assemblies and methods of manufacturing such assemblies | — | 2013-08-27 |
| 8362594 | Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material | Suan Jeung Boon, Yong Poo Chia | 2013-01-29 |
| 8288874 | Stackable semiconductor assemblies and methods of manufacturing such assemblies | — | 2012-10-16 |
| 8106488 | Wafer level packaging | Suan Jeung Boon, Yong Poo Chia, Neo Yong Loo | 2012-01-31 |
| 8065792 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Eng Meow Koon | 2011-11-29 |
| 7915711 | Semiconductor assemblies and methods of manufacturing such assemblies including trenches in a molding material between semiconductor die | Suan Jeung Boon, Yoon Poo Chia | 2011-03-29 |
| 7863722 | Stackable semiconductor assemblies and methods of manufacturing such assemblies | — | 2011-01-04 |
| 7820484 | Wafer level packaging | Suan Jeung Boon, Yong Poo Chia, Yong Loo Neo | 2010-10-26 |
| 7816750 | Thin semiconductor die packages and associated systems and methods | — | 2010-10-19 |
| 7712211 | Method for packaging circuits and packaged circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Eng Meow Koon | 2010-05-11 |
| 7674655 | Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material | Suan Jeung Boon, Yong Poo Chia | 2010-03-09 |
| 7553697 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2009-06-30 |
| 7485562 | Method of making multichip wafer level packages and computing systems incorporating same | Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2009-02-03 |
| 7375009 | Method of forming a conductive via through a wafer | Suan Jeung Boon, Yong Poo Chia, Yong Loo Neo | 2008-05-20 |
| 7304375 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Shuang Wu Huang +2 more | 2007-12-04 |
| 7274094 | Leadless packaging for image sensor devices | Suan Jeung Boon, Yong Poo Chia, Yong Loo Neo, Siu Waf Low | 2007-09-25 |
| 7193312 | Castellation wafer level packaging of integrated circuit chips | Suan Jeung Boon, Yong Poo Chia, Siu Waf Low, Meow Koon Eng, Shuang Wu Huang +2 more | 2007-03-20 |
| 7173330 | Multiple chip semiconductor package | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2007-02-06 |
| 7112471 | Leadless packaging for image sensor devices and methods of assembly | Suan Jeung Boon, Yong Poo Chia, Yong Loo Neo, Siu Waf Low | 2006-09-26 |
| 7087992 | Multichip wafer level packages and computing systems incorporating same | Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2006-08-08 |
| 6987031 | Multiple chip semiconductor package and method of fabricating same | Meow Koon Eng, Yong Poo Chia, Yong Loo Neo, Suan Jeung Boon, Siu Waf Low +1 more | 2006-01-17 |
| 6964881 | Multi-chip wafer level system packages and methods of forming same | Siu Waf Low, Yong Poo Chia, Meow Koon Eng, Yong Loo Neo, Suan Jeung Boon +2 more | 2005-11-15 |