Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10811278 | Method for packaging circuits | Chia Yong Poo, Low Siu Waf, Boon Suan Jeung, Chua Swee Kwang | 2020-10-20 |
| 10453704 | Method for packaging circuits | Chia Yong Poo, Low Siu Waf, Boon Suan Jeung, Chua Swee Kwang | 2019-10-22 |
| 9484225 | Method for packaging circuits | Chia Yong Poo, Low Siu Waf, Boon Suan Jeung, Chua Swee Kwang | 2016-11-01 |
| 8637973 | Packaged microelectronic components with terminals exposed through encapsulant | Low Siu Waf, Chan Min Yu, Chia Yong Poo, Ser Bok Leng, Zhou Wei | 2014-01-28 |
| 8629054 | Packaged semiconductor assemblies and methods for manufacturing such assemblies | Boon Suan Jeung, Chia Yong Poo | 2014-01-14 |
| 8555495 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Swee Kwang Chua | 2013-10-15 |
| 8138617 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2012-03-20 |
| 8115306 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Lou +4 more | 2012-02-14 |
| 8065792 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Swee Kwang Chua | 2011-11-29 |
| 8008126 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2011-08-30 |
| 7947529 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Chia Yong Poo, Boon Suan Jeung, Tay Wuu Yean | 2011-05-24 |
| 7712211 | Method for packaging circuits and packaged circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Swee Kwang Chua | 2010-05-11 |
| 7679179 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2010-03-16 |
| 7675169 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Waf, Chan Min Yu, Neo Yong Loo +4 more | 2010-03-09 |
| 7528477 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2009-05-05 |
| 7358154 | Method for fabricating packaged die | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2008-04-15 |
| 7276387 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2007-10-02 |
| 7195957 | Packaged microelectronic components | Low Siu Waf, Chan Min Yu, Chia Yong Poo, Ser Bok Leng, Zhou Wei | 2007-03-27 |
| 7170161 | In-process semiconductor packages with leadframe grid arrays | Chan Min Yu, Ser Bok Leng, Low Siu Waf, Chia Yong Poo | 2007-01-30 |
| 7115986 | Flexible ball grid array chip scale packages | Ow Chee Moon | 2006-10-03 |
| 6967127 | Methods for making semiconductor packages with leadframe grid arrays | Chan Min Yu, Ser Bok Leng, Low Siu Waf, Chia Yong Poo | 2005-11-22 |
| 6949407 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-09-27 |
| 6894386 | Apparatus and method for packaging circuits | Chia Yong Poo, Boon Suan Jeung, Low Siu Waf, Chan Min Yu, Neo Yong Loo +4 more | 2005-05-17 |
| 6855572 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2005-02-15 |
| 6836009 | Packaged microelectronic components | Low Siu Waf, Chan Min Yu, Chia Yong Poo, Ser Bok Leng, Zhou Wei | 2004-12-28 |