TY

Tay Wuu Yean

Micron: 13 patents #1,214 of 6,345Top 20%
Overall (All Time): #385,078 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
8399297 Methods of forming and assembling pre-encapsulated assemblies and of forming associated semiconductor device packages Wang Ai-Chie 2013-03-19
8072082 Pre-encapsulated cavity interposer Wang Ai-Chie 2011-12-06
7947529 Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods Eng Meow Koon, Chia Yong Poo, Boon Suan Jeung 2011-05-24
7573136 Semiconductor device assemblies and packages including multiple semiconductor device components Tongbi Jiang, Setho Sing Fee, Lim Thiam Chye 2009-08-11
7198980 Methods for assembling multiple semiconductor devices Tongbi Jiang, Setho Sing Fee, Lim Thiam Chye 2007-04-03
7145228 Microelectronic devices Victor Tan Cher Khng 2006-12-05
7112876 Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers Setho Sing Fee, Lim Thiam Chye 2006-09-26
6951777 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Setho Sing Fee, Lim Thiam Chye 2005-10-04
6946325 Methods for packaging microelectronic devices Victor Tan Cher Khng 2005-09-20
6913476 Temporary, conformable contacts for microelectronic components Lee Choon Kuan 2005-07-05
6906415 Semiconductor device assemblies and packages including multiple semiconductor devices and methods Tongbi Jiang, Setho Sing Fee, Lim Thiam Chye 2005-06-14
6870247 Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled Setho Sing Fee, Lim Thiam Chye 2005-03-22
6773960 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate Setho Sing Fee, Lim Thiam Chye 2004-08-10