| 8709866 |
Methods of forming integrated circuit packages |
Lim Thiam Chye, Tongbi Jiang |
2014-04-29 |
$9,450,000 |
| 8703599 |
Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts |
— |
2014-04-22 |
$11,465,000 |
| 8531031 |
Integrated circuit packages |
Lim Thiam Chye, Tongbi Jiang |
2013-09-10 |
$5,150,000 |
| 8319332 |
Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts |
— |
2012-11-27 |
$2,638,000 |
| 7977157 |
Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages |
Lim Thiam Chye, Tongbi Jiang |
2011-07-12 |
$2,990,000 |
| 7745944 |
Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts |
— |
2010-06-29 |
$3,072,000 |
| 7700406 |
Methods of assembling integrated circuit packages |
Lim Thiam Chye, Tongbi Jiang |
2010-04-20 |
$2,608,000 |
| 7573136 |
Semiconductor device assemblies and packages including multiple semiconductor device components |
Tongbi Jiang, Tay Wuu Yean, Lim Thiam Chye |
2009-08-11 |
$4,144,000 |
| 7528007 |
Methods for assembling semiconductor devices and interposers |
Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay +3 more |
2009-05-05 |
$2,582,000 |
| 7294911 |
Ultrathin leadframe BGA circuit package |
Teck Kheng Lee, Tan Kian |
2007-11-13 |
$2,812,000 |
| 7279780 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Lim Thiam Chye |
2007-10-09 |
$1,129,000 |
| 7274095 |
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers |
Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay +3 more |
2007-09-25 |
$1,063,000 |
| 7198980 |
Methods for assembling multiple semiconductor devices |
Tongbi Jiang, Tay Wuu Yean, Lim Thiam Chye |
2007-04-03 |
$1,555,000 |
| 7183134 |
Ultrathin leadframe BGA circuit package |
Teck Kheng Lee, Tan Kian |
2007-02-27 |
$1,963,000 |
| 7112876 |
Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers |
Tay Wuu Yean, Lim Thiam Chye |
2006-09-26 |
$2,567,000 |
| 7109572 |
Quad flat no lead (QFN) grid array package |
Lim Thiam Chye |
2006-09-19 |
$3,699,000 |
| 7075816 |
Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same |
Lim Thiam Chye |
2006-07-11 |
$2,452,000 |
| 6967125 |
Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same |
Lim Thiam Chye |
2005-11-22 |
$1,784,000 |
| 6951777 |
Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate |
Tay Wuu Yean, Lim Thiam Chye |
2005-10-04 |
$1,778,000 |
| 6951982 |
Packaged microelectronic component assemblies |
Lim Thiam Chye, Eric Tan Swee Seng |
2005-10-04 |
$1,778,000 |
| 6943450 |
Packaged microelectronic devices and methods of forming same |
Lim Thiam Chye, Eric Tan Swee Seng |
2005-09-13 |
$2,019,000 |
| 6906415 |
Semiconductor device assemblies and packages including multiple semiconductor devices and methods |
Tongbi Jiang, Tay Wuu Yean, Lim Thiam Chye |
2005-06-14 |
$1,402,000 |
| 6876066 |
Packaged microelectronic devices and methods of forming same |
Lim Thiam Chye, Eric Tan Swee Seng |
2005-04-05 |
$1,884,000 |
| 6870247 |
Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled |
Tay Wuu Yean, Lim Thiam Chye |
2005-03-22 |
$1,900,000 |
| 6828671 |
Enhanced BGA grounded heatsink |
Weddie Aquien, John Briar |
2004-12-07 |
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