| 7528007 |
Methods for assembling semiconductor devices and interposers |
Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more |
2009-05-05 |
| 7274095 |
Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers |
Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more |
2007-09-25 |
| 6746894 |
Ball grid array interposer, packages and methods |
Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more |
2004-06-08 |
| 6617201 |
U-shape tape for BOC FBGA package to improve moldability |
Lim Thiam Chye, Lee Choon Kuan, Jeffrey Toh, Tim Teoh, Choong L. Wah |
2003-09-09 |
| 6486536 |
U-shape tape for BOC FBGA package to improve moldability |
Lim Thiam Chye, Lee Choon Kuan, Jeffery Toh, Tim Teoh, Choong L. Wah |
2002-11-26 |
