Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 7528007 | Methods for assembling semiconductor devices and interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2009-05-05 | $2,582,000 |
| 7274095 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2007-09-25 | $1,063,000 |
| 6746894 | Ball grid array interposer, packages and methods | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2004-06-08 | $2,376,000 |
| 6617201 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Lee Choon Kuan, Jeffrey Toh, Tim Teoh, Choong L. Wah | 2003-09-09 | $3,971,000 |
| 6486536 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Lee Choon Kuan, Jeffery Toh, Tim Teoh, Choong L. Wah | 2002-11-26 | $5,696,000 |