Issued Patents All Time
Showing 25 most recent of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8709866 | Methods of forming integrated circuit packages | Setho Sing Fee, Tongbi Jiang | 2014-04-29 |
| 8531031 | Integrated circuit packages | Setho Sing Fee, Tongbi Jiang | 2013-09-10 |
| 7977157 | Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages | Setho Sing Fee, Tongbi Jiang | 2011-07-12 |
| 7700406 | Methods of assembling integrated circuit packages | Setho Sing Fee, Tongbi Jiang | 2010-04-20 |
| 7573136 | Semiconductor device assemblies and packages including multiple semiconductor device components | Tongbi Jiang, Setho Sing Fee, Tay Wuu Yean | 2009-08-11 |
| 7528007 | Methods for assembling semiconductor devices and interposers | Setho Sing Fee, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay +3 more | 2009-05-05 |
| 7368810 | Invertible microfeature device packages | Eric Tan Swee Seng | 2008-05-06 |
| 7279780 | Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same | Setho Sing Fee | 2007-10-09 |
| 7274095 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers | Setho Sing Fee, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay +3 more | 2007-09-25 |
| 7198980 | Methods for assembling multiple semiconductor devices | Tongbi Jiang, Setho Sing Fee, Tay Wuu Yean | 2007-04-03 |
| 7112876 | Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers | Setho Sing Fee, Tay Wuu Yean | 2006-09-26 |
| 7109572 | Quad flat no lead (QFN) grid array package | Setho Sing Fee | 2006-09-19 |
| 7075816 | Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same | Setho Sing Fee | 2006-07-11 |
| 6967125 | Quad flat no lead (QFN) grid array package, method of making and memory module and computer system including same | Setho Sing Fee | 2005-11-22 |
| 6951777 | Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate | Setho Sing Fee, Tay Wuu Yean | 2005-10-04 |
| 6951982 | Packaged microelectronic component assemblies | Setho Sing Fee, Eric Tan Swee Seng | 2005-10-04 |
| 6943450 | Packaged microelectronic devices and methods of forming same | Setho Sing Fee, Eric Tan Swee Seng | 2005-09-13 |
| 6906415 | Semiconductor device assemblies and packages including multiple semiconductor devices and methods | Tongbi Jiang, Setho Sing Fee, Tay Wuu Yean | 2005-06-14 |
| 6876066 | Packaged microelectronic devices and methods of forming same | Setho Sing Fee, Eric Tan Swee Seng | 2005-04-05 |
| 6870247 | Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled | Setho Sing Fee, Tay Wuu Yean | 2005-03-22 |
| 6864166 | Method of manufacturing wire bonded microelectronic device assemblies | Leng Nam Yin | 2005-03-08 |
| 6825572 | Die package | Edmund Lua Koon Tian | 2004-11-30 |
| 6773960 | Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate | Setho Sing Fee, Tay Wuu Yean | 2004-08-10 |
| 6746894 | Ball grid array interposer, packages and methods | Setho Sing Fee, Steven W. Heppler, Leng Nam Yin, Keith Tan, Patrick Guay +3 more | 2004-06-08 |
| 6650013 | Method of manufacturing wire bonded microelectronic device assemblies | Leng Nam Yin | 2003-11-18 |