Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101245 | Multi-chip modules including stacked semiconductor dice | — | 2021-08-24 |
| 9269695 | Semiconductor device assemblies including face-to-face semiconductor dice and related methods | Lee Choon Kuan | 2016-02-23 |
| 9070641 | Methods for forming assemblies and multi-chip modules including stacked semiconductor dice | — | 2015-06-30 |
| 8384200 | Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies | Lee Choon Kuan | 2013-02-26 |
| 8237290 | Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads | — | 2012-08-07 |
| 7691726 | Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components | — | 2010-04-06 |
| 7528007 | Methods for assembling semiconductor devices and interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2009-05-05 |
| 7492039 | Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads | — | 2009-02-17 |
| 7368810 | Invertible microfeature device packages | Lim Thiam Chye | 2008-05-06 |
| 7365424 | Microelectronic component assemblies with recessed wire bonds and methods of making same | Edmund Low Kwok Chung | 2008-04-29 |
| 7276790 | Methods of forming a multi-chip module having discrete spacers | — | 2007-10-02 |
| 7274095 | Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2007-09-25 |
| 7259451 | Invertible microfeature device packages | Thiam Chye Lim | 2007-08-21 |
| 7218001 | Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components | — | 2007-05-15 |
| 6951982 | Packaged microelectronic component assemblies | Lim Thiam Chye, Setho Sing Fee | 2005-10-04 |
| 6943450 | Packaged microelectronic devices and methods of forming same | Setho Sing Fee, Lim Thiam Chye | 2005-09-13 |
| 6876066 | Packaged microelectronic devices and methods of forming same | Setho Sing Fee, Lim Thiam Chye | 2005-04-05 |
| 6746894 | Ball grid array interposer, packages and methods | Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more | 2004-06-08 |