ES

Eric Tan Swee Seng

Micron: 18 patents #949 of 6,345Top 15%
Overall (All Time): #253,923 of 4,157,543Top 7%
18
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
11101245 Multi-chip modules including stacked semiconductor dice — 2021-08-24
9269695 Semiconductor device assemblies including face-to-face semiconductor dice and related methods Lee Choon Kuan 2016-02-23
9070641 Methods for forming assemblies and multi-chip modules including stacked semiconductor dice — 2015-06-30
8384200 Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies Lee Choon Kuan 2013-02-26
8237290 Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads — 2012-08-07
7691726 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components — 2010-04-06
7528007 Methods for assembling semiconductor devices and interposers Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more 2009-05-05
7492039 Assemblies and multi-chip modules including stacked semiconductor dice having centrally located, wire bonded bond pads — 2009-02-17
7368810 Invertible microfeature device packages Lim Thiam Chye 2008-05-06
7365424 Microelectronic component assemblies with recessed wire bonds and methods of making same Edmund Low Kwok Chung 2008-04-29
7276790 Methods of forming a multi-chip module having discrete spacers — 2007-10-02
7274095 Interposers with receptacles for receiving semiconductor devices and assemblies and packages including such interposers Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more 2007-09-25
7259451 Invertible microfeature device packages Thiam Chye Lim 2007-08-21
7218001 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components — 2007-05-15
6951982 Packaged microelectronic component assemblies Lim Thiam Chye, Setho Sing Fee 2005-10-04
6943450 Packaged microelectronic devices and methods of forming same Setho Sing Fee, Lim Thiam Chye 2005-09-13
6876066 Packaged microelectronic devices and methods of forming same Setho Sing Fee, Lim Thiam Chye 2005-04-05
6746894 Ball grid array interposer, packages and methods Setho Sing Fee, Lim Thiam Chye, Steven W. Heppler, Leng Nam Yin, Keith Tan +3 more 2004-06-08