Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7365424 | Microelectronic component assemblies with recessed wire bonds and methods of making same | Eric Tan Swee Seng | 2008-04-29 |
| 7250328 | Microelectronic component assemblies with recessed wire bonds and methods of making same | Erin Tan Swee Seng | 2007-07-31 |