Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673121 | Carrierless chip package for integrated circuit devices, and methods of making same | David J. Corisis, Chong Chin Hui | 2017-06-06 |
| 9355992 | Land grid array semiconductor device packages | David J. Corisis, Chin Hui Chong | 2016-05-31 |
| 9269695 | Semiconductor device assemblies including face-to-face semiconductor dice and related methods | Eric Tan Swee Seng | 2016-02-23 |
| 8444044 | Apparatus and methods for forming wire bonds | Low Peng Wang, Mitchell T. Ong | 2013-05-21 |
| 8384200 | Semiconductor device assemblies including face-to-face semiconductor dice and systems including such assemblies | Eric Tan Swee Seng | 2013-02-26 |
| 8125092 | Semiconductor device packages and assemblies | David J. Corisis, Chong Chin Hui | 2012-02-28 |
| 7767913 | Electronic devices including conductive vias having two or more conductive elements for providing electrical communication between traces in different planes in a substrate, and accompanying methods | David J. Corisis, Chin Hui Chong | 2010-08-03 |
| 7691682 | Build-up-package for integrated circuit devices, and methods of making same | Ng Hong Wan, David J. Corisis, Chong Chin Hui | 2010-04-06 |
| 7504285 | Carrierless chip package for integrated circuit devices, and methods of making same | David J. Corisis, Chong Chin Hui | 2009-03-17 |
| 7465488 | Bow control in an electronic package | Lee Kian Chai | 2008-12-16 |
| 7459778 | Chip on board leadframe for semiconductor components having area array | Dalson Ye Seng Kim, Jeffrey Toh Tuck Fook | 2008-12-02 |
| 7235872 | Bow control in an electronic package | Lee Kian Chai | 2007-06-26 |
| 7161236 | Bow control in an electronic package | Lee Kian Chai | 2007-01-09 |
| 7049173 | Method for fabricating semiconductor component with chip on board leadframe | Dalson Ye Seng Kim, Jeffrey Toh Tuck Fook | 2006-05-23 |
| 6972214 | Method for fabricating a semiconductor package with multi layered leadframe | Chong Chin Hui, Lee Wang Lai | 2005-12-06 |
| 6913476 | Temporary, conformable contacts for microelectronic components | Tay Wuu Yean | 2005-07-05 |
| 6903449 | Semiconductor component having chip on board leadframe | Dalson Ye Seng Kim, Jeffrey Toh Tuck Fook | 2005-06-07 |
| 6835599 | Method for fabricating semiconductor component with multi layered leadframe | Chong Chin Hui, Lee Wang Lai | 2004-12-28 |
| 6784525 | Semiconductor component having multi layered leadframe | Chong Chin Hui, Lee Wang Lai | 2004-08-31 |
| 6617201 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Jeffrey Toh, Tim Teoh, Patrick Guay, Choong L. Wah | 2003-09-09 |
| 6507114 | BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die | Chong Chin Hui, Lee Kian Chai | 2003-01-14 |
| 6486536 | U-shape tape for BOC FBGA package to improve moldability | Lim Thiam Chye, Jeffery Toh, Tim Teoh, Patrick Guay, Choong L. Wah | 2002-11-26 |