| 8269328 |
Stacked die package for peripheral and center device pad layout device |
Dalson Ye Seng Kim, Chong Chin Hui, Roslan Bin Said |
2012-09-18 |
| 7846768 |
Stacked die package for peripheral and center device pad layout device |
Dalson Ye Seng Kim, Chong Chin Hui, Roslan Bin Said |
2010-12-07 |
| 7425463 |
Stacked die package for peripheral and center device pad layout device |
Dalson Ye Seng Kim, Chong Chin Hui, Roslan Bin Said |
2008-09-16 |
| 7205656 |
Stacked device package for peripheral and center device pad layout device |
Dalson Ye Seng Kim, Chong Chin Hui, Roslan Bin Said |
2007-04-17 |
| 6972214 |
Method for fabricating a semiconductor package with multi layered leadframe |
Lee Choon Kuan, Chong Chin Hui |
2005-12-06 |
| 6835599 |
Method for fabricating semiconductor component with multi layered leadframe |
Lee Choon Kuan, Chong Chin Hui |
2004-12-28 |
| 6784525 |
Semiconductor component having multi layered leadframe |
Lee Choon Kuan, Chong Chin Hui |
2004-08-31 |
