Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8269328 | Stacked die package for peripheral and center device pad layout device | Chong Chin Hui, Lee Wang Lai, Roslan Bin Said | 2012-09-18 |
| 7846768 | Stacked die package for peripheral and center device pad layout device | Chong Chin Hui, Lee Wang Lai, Roslan Bin Said | 2010-12-07 |
| 7459778 | Chip on board leadframe for semiconductor components having area array | Jeffrey Toh Tuck Fook, Lee Choon Kuan | 2008-12-02 |
| 7425463 | Stacked die package for peripheral and center device pad layout device | Chong Chin Hui, Lee Wang Lai, Roslan Bin Said | 2008-09-16 |
| 7205656 | Stacked device package for peripheral and center device pad layout device | Chong Chin Hui, Lee Wang Lai, Roslan Bin Said | 2007-04-17 |
| 7049173 | Method for fabricating semiconductor component with chip on board leadframe | Jeffrey Toh Tuck Fook, Lee Choon Kuan | 2006-05-23 |
| 6903449 | Semiconductor component having chip on board leadframe | Jeffrey Toh Tuck Fook, Lee Choon Kuan | 2005-06-07 |