Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9673121 | Carrierless chip package for integrated circuit devices, and methods of making same | David J. Corisis, Lee Choon Kuan | 2017-06-06 |
| 8749050 | Redistribution elements and semiconductor device packages including semiconductor devices and redistribution elements | Choon Kuan Lee, David J. Corisis | 2014-06-10 |
| 8653625 | Interposer structure with embedded capacitor structure, and methods of making same | David J. Corisis, Choon Kuan Lee | 2014-02-18 |
| 8486825 | Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices | Choon Kuan Lee, David J. Corisis | 2013-07-16 |
| 8288859 | Semiconductor device packages including a semiconductor device and a redistribution element | Choon Kuan Lee, David J. Corisis | 2012-10-16 |
| 8269328 | Stacked die package for peripheral and center device pad layout device | Dalson Ye Seng Kim, Lee Wang Lai, Roslan Bin Said | 2012-09-18 |
| 8125092 | Semiconductor device packages and assemblies | David J. Corisis, Lee Choon Kuan | 2012-02-28 |
| 7846768 | Stacked die package for peripheral and center device pad layout device | Dalson Ye Seng Kim, Lee Wang Lai, Roslan Bin Said | 2010-12-07 |
| 7816778 | Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same | Choon Kuan Lee, David J. Corisis | 2010-10-19 |
| 7691682 | Build-up-package for integrated circuit devices, and methods of making same | Ng Hong Wan, Lee Choon Kuan, David J. Corisis | 2010-04-06 |
| 7504285 | Carrierless chip package for integrated circuit devices, and methods of making same | David J. Corisis, Lee Choon Kuan | 2009-03-17 |
| 7425463 | Stacked die package for peripheral and center device pad layout device | Dalson Ye Seng Kim, Lee Wang Lai, Roslan Bin Said | 2008-09-16 |
| 7205656 | Stacked device package for peripheral and center device pad layout device | Dalson Ye Seng Kim, Lee Wang Lai, Roslan Bin Said | 2007-04-17 |
| 6972214 | Method for fabricating a semiconductor package with multi layered leadframe | Lee Choon Kuan, Lee Wang Lai | 2005-12-06 |
| 6835599 | Method for fabricating semiconductor component with multi layered leadframe | Lee Choon Kuan, Lee Wang Lai | 2004-12-28 |
| 6784525 | Semiconductor component having multi layered leadframe | Lee Choon Kuan, Lee Wang Lai | 2004-08-31 |
| 6781248 | Method for encapsulating intermediate conductive elements connecting a semiconductor die to a substrate and semiconductor devices so packaged | Lee Kian Chai, Jason Pittam | 2004-08-24 |
| 6638792 | Method for fabricating BOC semiconductor package | Lee Choon Kian, Lee Kian Chai | 2003-10-28 |
| 6507114 | BOC semiconductor package including a semiconductor die and a substrate bonded circuit side down to the die | Lee Choon Kuan, Lee Kian Chai | 2003-01-14 |